Display apparatus

ABSTRACT

A display apparatus including a first conductive layer; a first insulating layer including a first opening exposing a first upper surface of the first conductive layer and covering at least a part of an upper edge of the first conductive layer, wherein the first upper surface of the first conductive layer includes a center portion of an upper surface of the first conductive layer; a second conductive layer on a part of the first upper surface of the first conductive layer and on the first insulating layer; and a second insulating layer including a second opening exposing a second upper surface of the second conductive layer and covering a part of an upper edge of the second conductive layer, wherein the second upper surface of the second conductive layer includes a center portion of the upper surface of the second conductive layer.

CROSS-REFERENCE TO RELATED APPLICATIONS

This is a continuation application based on pending application U.S.patent application Ser. No. 16/038,476, filed on Jul. 18, 2018, thedisclosure of which is incorporated herein by reference in its entirety.U.S. patent application Ser. No. 16/038,476 is a continuationapplication of U.S. patent application Ser. No. 15/297,198, filed Oct.19, 2016, now U.S. Pat. No. 10,032,845, issued Jul. 24, 2018, thedisclosure of which is incorporated herein by reference in its entirety.U.S. Pat. No. 10,032,845 claims priority benefit of Korean PatentApplication No. 10-2016-0042801, filed on Apr. 7, 2016, in the KoreanIntellectual Property Office, and entitled, “Display Apparatus,” thedisclosure of which is incorporated herein by reference in its entiretyfor all purposes.

BACKGROUND 1. Field

Embodiments relate to a display apparatus.

2. Description of the Related Art

In general, a display apparatus may include a plurality of displaydevices on a display area. In addition, wires for transferring electricsignals that are applied to the display area may be provided on aperiphery of the display area.

SUMMARY

The embodiments may be realized by providing a display apparatusincluding a substrate that includes a display area and a peripheralarea, the peripheral area being outside of the display area; a firstconductive layer in the peripheral area; a first insulating layer thatincludes a first opening exposing a first upper surface of the firstconductive layer and covering at least a part of an upper edge of thefirst conductive layer, wherein the first upper surface of the firstconductive layer includes at least a center portion of an upper surfaceof the first conductive layer; a second conductive layer on at least apart of the first upper surface of the first conductive layer and on thefirst insulating layer; and a second insulating layer that includes asecond opening exposing a second upper surface of the second conductivelayer and covering at least a part of an upper edge of the secondconductive layer, wherein the second upper surface of the secondconductive layer includes at least a center portion of the upper surfaceof the second conductive layer and the second opening has an area thatis less than an area of the first opening.

The upper surface of the second conductive layer may include a flatportion at the center portion thereof, and the second insulating layermay cover the upper surface of the second conductive layer except atleast a part of the flat portion.

The upper surface of the second conductive layer may have a curvedsurface in a part thereof, and the second insulating layer may cover thecurved surface in the upper surface of the second conductive layer.

The display apparatus may further include a thin film transistor in thedisplay area, the thin film transistor including a gate electrode, asource electrode, and a drain electrode, and wherein the firstconductive layer includes a material that is the same as a material ofthe gate electrode, and the second conductive layer includes a materialthat is the same as a material of the source electrode and the drainelectrode.

The first insulating layer may include a material that is the same as amaterial of an interlayer insulating layer that is between the sourceand drain electrodes and the gate electrode, and the second insulatinglayer may include a material that is the same as a material of aprotective layer covering the source electrode and the drain electrode.

The first insulating layer may be integral with the interlayerinsulating layer, and the second insulating layer may be integral withthe protective layer.

The display apparatus may further include a third conductive layer onthe second upper surface of the second conductive layer and the secondinsulating layer.

The display apparatus may further include a thin film transistor in thedisplay area, the thin film transistor including a gate electrode, asource electrode, and a drain electrode; and a pixel electrodeelectrically connected to one of the source electrode and the drainelectrode, wherein the first conductive layer includes a material thatis the same as a material of the gate electrode, the second conductivelayer includes a material that is the same as a material of the sourceelectrode and the drain electrode, and the third conductive layerincludes a material that is the same as a material of the pixelelectrode.

The first insulating layer may include a material that is the same as amaterial of an interlayer insulating layer between the source and drainelectrodes and the gate electrode, and the second insulating layer mayinclude a material that is the same as a material of a protective layercovering the source electrode and the drain electrode.

The first insulating layer may be integral with the interlayerinsulating layer, and the second insulating layer may be integral withthe protective layer.

The display apparatus may further include an opposite electrode that isprovided integrally throughout the display area and extending to a partof the peripheral area, wherein the opposite electrode electricallycontacts the third conductive layer.

The display apparatus may further include an opposite electrode that isprovided integrally throughout the display area and extending to a partof the peripheral area, wherein the opposite electrode is electricallyconnected to the second conductive layer.

The first conductive layer may have an island shape.

The embodiments may be realized by providing a display apparatusincluding a substrate that includes a display area and a peripheralarea, the display area including pixels and the peripheral area beingoutside of the display area; and an electrode power supply lineelectrically connected to the pixels of the display area, wherein theelectrode power supply line includes a connecting conductive layer, anda main conductive layer connected by the connecting conductive layer,wherein the connecting conductive layer has a connection side that isconnected to the main conductive layer and a substrate facing side thatis opposite to the connection side and that faces the substrate, whereina first insulating layer overlies an outer edge of the connection sideof the connecting conductive layer and includes a first opening that isopen on a central portion of the connection side of the connectingconductive layer, wherein the main conductive layer contacts theconnection side of the connecting conductive layer at the centralportion of the connection side of the connecting conductive layer, andwherein a second insulating layer overlies an outer edge of an outwardlyfacing surface of the main conductive layer and includes a secondopening that is open on a central portion of the outwardly facingsurface of the main conductive layer, and wherein the second opening hasan area that is smaller than an area of the first opening.

The central portion of the outwardly facing surface of the mainconductive layer may include a flat portion, and the second insulatinglayer may cover portions of the outwardly facing surface of the mainconductive layer that surround the flat portion.

The outwardly facing surface of the main conductive layer may have acurved surface in a part thereof, and the second insulating layer maycover the curved surface of the outwardly facing surface of the mainconductive layer.

The connecting conductive layer may have an island shape.

The display apparatus may further include a third conductive layer onthe outwardly facing surface of the main conductive layer and the secondinsulating layer.

BRIEF DESCRIPTION OF THE DRAWINGS

Features will be apparent to those of skill in the art by describing indetail exemplary embodiments with reference to the attached drawings inwhich:

FIG. 1 illustrates a schematic plan view of a part of a displayapparatus according to an embodiment;

FIG. 2 illustrates a schematic plan view of a part of a displayapparatus according to an embodiment;

FIG. 3 illustrates a partially enlarged view of a part A in the displayapparatus of FIG. 1;

FIG. 4 illustrates a schematic cross-sectional view of a conductivelayer in the display apparatus of FIG. 1;

FIG. 5 illustrates a schematic cross-sectional view of the displayapparatus taken along a line V-V of FIG. 3;

FIG. 6 illustrates a schematic cross-sectional view of the displayapparatus taken along a line VI-VI of FIG. 3;

FIG. 7 illustrates a schematic plan view of a part of a displayapparatus according to an embodiment;

FIG. 8 illustrates a schematic cross-sectional view of the displayapparatus taken along a line VIII-VIII of FIG. 1; and

FIG. 9 illustrates a schematic cross-sectional view of the displayapparatus taken along a line IX-IX of FIG. 1.

DETAILED DESCRIPTION

Example embodiments will now be described more fully hereinafter withreference to the accompanying drawings; however, they may be embodied indifferent forms and should not be construed as limited to theembodiments set forth herein. Rather, these embodiments are provided sothat this disclosure will be thorough and complete, and will fullyconvey exemplary implementations to those skilled in the art.

In the drawing figures, the dimensions of layers and regions may beexaggerated for clarity of illustration. It will also be understood thatwhen a layer or element is referred to as being “on” another layer orelement, it can be directly on the other layer or element, orintervening elements may also be present. Further, it will be understoodthat when an element is referred to as being “under” another element, itcan be directly under, and one or more intervening elements may also bepresent. In addition, it will also be understood that when an element isreferred to as being “between” two elements, it can be the only elementbetween the two elements, or one or more intervening elements may alsobe present. Like reference numerals refer to like elements throughout.

As used herein, the term “and/or” and “or” includes any and allcombinations of one or more of the associated listed items. Expressionssuch as “at least one of,” when preceding a list of elements, modify theentire list of elements and do not modify the individual elements of thelist.

In the following examples, the x-axis, the y-axis and the z-axis are notlimited to three axes of the rectangular coordinate system, and may beinterpreted in a broader sense. For example, the x-axis, the y-axis, andthe z-axis may be perpendicular to one another, or may representdifferent directions that are not perpendicular to one another.

FIG. 1 illustrates a schematic plan view of a part of a displayapparatus according to an embodiment. As shown in FIG. 1, the displayapparatus may include, e.g., a substrate 100 that includes a displayarea DA and a peripheral area PA (on or at an outer portion of thedisplay area DA). Display devices such as an organic light-emittingdevice may be arranged over the display area DA of the substrate 100,and thin film transistors electrically connected to the display devicesmay also be arranged over the display area DA. Configurations of thedisplay area DA will be described below.

The substrate 100 may include various materials having flexible orbendable characteristics, e.g., polymer resins such as polyethersulphone(PES), polyacrylate (PAR), polyetherimide (PEI), polyethylene napthalate(PEN), polyethyleneterephthalate (PET), polyphenylene sulfide (PPS),polyarylate, polyimide (PI), polycarbonate (PC), or cellulose acetatepropionate (CAP).

A wire may be arranged on the peripheral area PA at the outer portion ofthe display area DA of the substrate 100. The wire may be, e.g., anelectrode power supply line (EPSL). In FIG. 1, the electrode powersupply line EPSL roughly surrounds the display area DA, e.g., may have aU-shape or an inverted U-shape. Accordingly, electric signals fromoutside may be supplied via two pads at an edge (in a +x direction) ofthe substrate 100. Here, pads may denote ends of the electrode powersupply line EPSL, or the ends of the electrode power supply line EPSLand portions electrically connected to the ends.

In an implementation, the number of the electrode power supply line EPSLand a shape of the electrode power supply line EPSL may be variouslymodified. For example, as shown in FIG. 2 (which is a schematic planview of a part of a display apparatus according to an embodiment), theelectrode power supply line EPSL may include a plurality of wires EPSL1and EPSL2 that are in parallel with each other, and the plurality ofwires EPSL1 and EPSL2 may be electrically connected to each other. In animplementation, the electrode power supply line EPSL may include theplurality of wires EPSL1 and EPSL2 that are in parallel with each other,and branch wires BW for electrically connecting the plurality of wiresEPSL1 and EPSL2. Each of the plurality of wires EPSL1 and EPSL2 may havea shape that is similar to that of the electrode power supply line EPSLshown in FIG. 1.

The electrode power supply line EPSL as described above may be located,e.g., within the display area DA, and may be electrically connected toan opposite electrode that is a common electrode extending to outsidethe display area DA to apply electric signals to the opposite electrode.

FIG. 3 illustrates a partially enlarged view of a portion A in thedisplay apparatus of FIG. 1, and shows a connecting structure of theelectrode power supply line EPSL. As illustrated in FIG. 1, theelectrode power supply line EPSL may have an integrated shape withoutdisconnection. As shown in FIG. 3, the electrode power supply line EPSLmay be disconnected at a part. In FIG. 3, the electrode power supplyline EPSL extending in the +x direction may be disconnected. In animplementation, a first conductive layer 213 a (e.g., a connectingconductive layer) may be provided under or adjacent to the electrodepower supply line EPSL and the first conductive layer 213 a iselectrically connected to the electrode power supply line EPSL, and theelectric signals may be transferred via the electrode power supply lineEPSL even if the electrode power supply line EPSL is disconnected.

The electrode power supply line EPSL may include a second conductivelayer 215 c (e.g., a main conductive layer) as will be described below,and the second conductive layer 215 c may have a multiple-layeredstructure as shown in FIG. 4. For example, as shown in FIG. 4, thesecond conductive layer 215 c may include a lower layer 215 c 1, anintermediate layer 215 c 2, and an upper layer 215 c 3. The lower layer215 c 1, e.g., a conductive layer, may be formed by using a material,the intermediate layer 215 c 2, e.g., a conductive layer, may be formedby using a material, and the upper layer 215 c 3, e.g., a conductivelayer, may be formed by using a material. After that, the threeconductive layers may be patterned simultaneously to obtain the secondconductive layer 215 c.

If etch rates of the three conductive layers are not identical with oneanother during manufacturing the second conductive layer 215 c asdescribed above, side surfaces of the second conductive layer 215 c maynot be consistent. For example, the lower layer 215 c 1 and the upperlayer 215 c 3 may include titanium, and the intermediate layer 215 c 2may include aluminum. In this case, a wet etch rate of the aluminum maybe greater than that of the titanium, and the side surfaces of theintermediate layer 215 c 2 may be concave after finishing the patterningprocess as shown in FIG. 4. Thus, the second conductive layer 215 c mayhave the side surfaces having concave center portions, and as will bedescribed below, a crack may occur in an encapsulation layer 400 aroundthe side surfaces of the second conductive layer 215 c when forming theencapsulation layer 400 covering the second conductive layer 215 c.

As described above with reference to FIG. 1, the electrode power supplyline EPSL may have the U-shape or the inverted U-shape, and the electricsignals from the outside may be applied via the two pads at the edge ofthe substrate (in the +x direction). Here, the pads may denote endportions of the electrode power supply line EPSL, or portions includingthe end portions and parts electrically connected to the end portions.

If the electrode power supply line EPSL were to be continuouslyconnected to the pads without disconnection, the pads may also have thestructure that is the same as that of the electrode power supply lineEPSL. Therefore, a crack could occur in the pads or the encapsulationlayer 400 around the pads. Thus, impurities such as external moisture oroxygen could infiltrate into the display panel via the crack and causedefects in the display devices of the display area DA, which areadjacent to the crack.

The crack could also occur in the encapsulation layer 400 adjacent tothe other parts of the electrode power supply line EPSL and may affectthe display devices nearby. However, the pads or portions adjacent tothe pads in the electrode power supply line EPSL may be at the edge ofthe substrate 100 (in the +x direction) as shown in FIG. 1, and thus, ifthe crack were to occur in the encapsulation layer 400 around the padsor the adjacent portions, it could be much easier for the impuritiessuch as the external moisture or oxygen to infiltrate into the displaypanel and directly and largely affect the corresponding portions of thedisplay area DA. The impurities infiltrated into through the crack thathas occurred around the pads or the adjacent portions may infiltrateinto the display panel along the electrode power supply line EPSL.

In the display apparatus according to the embodiment, the electrodepower supply line EPSL (including the second conductive layer 215 c) maybe disconnected as shown in FIG. 3. Therefore, the crack may not occurin the encapsulation layer 400 at the portion where the electrode powersupply line EPSL is disconnected. Then, even if the impurities were toinfiltrate through a crack in the encapsulation layer 400 around thepads or the adjacent portions, the impurities may not further infiltratealong the electrode power supply line EPSL at the disconnected portionof the electrode power supply line EPSL. Also, there may be no crack inthe encapsulation layer 400 at the disconnected portion of the electrodepower supply line EPSL, and the impurities may not infiltrate into thedisplay area DA. As such, defects that could otherwise occur in thedisplay apparatus may be effectively prevented during manufacturing thedisplay apparatus and utilizing the display apparatus.

Hereinafter, structures of the first conductive layer 213 a and theelectrode power supply line EPSL will be described in more detail below.

FIG. 5 illustrates a schematic cross-sectional view of the displayapparatus taken along a line V-V of FIG. 3. FIG. 6 illustrates aschematic cross-sectional view of the display apparatus taken along aline VI-VI of FIG. 3.

As shown in FIGS. 5 and 6, the first conductive layer 213 a may belocated on the substrate 100. For example, the first conductive layer213 a may be arranged on a buffer layer 110 and a gate insulating layer120 on the substrate 100, e.g., such that the buffer layer 110 and thegate insulating layer 120 are between the first conductive layer 213 aand the substrate 100. The first conductive layer 213 a may have, e.g.,a single-layered structure or a multi-layered structure. In latter case,the first conductive layer 213 a may include, e.g., a layer includingmolybdenum and a layer including tungsten. In an implementation, thefirst conductive layer 213 a may have three or more layers.

The first conductive layer 213 a may be formed as an island in plan view(e.g., on an xy plane) as shown in FIG. 3. As described above withreference to FIG. 2, when the electrode power supply line EPSL includesthe plurality of wires EPSL1 and EPSL2, each of the plurality of wiresEPSL1 and EPSL2 may be disconnected as shown in FIG. 7 (whichillustrates a schematic plan view of a part of a display apparatusaccording to an embodiment). In an implementation, the first conductivelayer 213 a may be located under the plurality of wires EPSL1 and EPSL2to be electrically connected to the plurality of wires EPSL1 and EPSL2,and accordingly, the electric signals may be transferred via theplurality of wires EPSL1 and EPSL2 even if the plurality of wires EPSL1and EPSL2 are disconnected. In an implementation, one first conductivelayer 213 a may contact all of the plurality of wires EPSL1 and EPSL2.In this case, the first conductive layer 213 a may be formed as anisland on a plan view like FIG. 7 (on the xy plane).

The first conductive layer 213 a may be partially covered by aninterlayer insulating layer 130, e.g., a first insulating layer. Forexample, the interlayer insulating layer 130 may partially cover thefirst conductive layer 213 a and may have a first opening OP1. The firstopening OP1 may expose or overlie a first upper surface 213 a′ (e.g.,connection side) including at least a center portion of an upper surfaceof the first conductive layer 213 a (in the +z direction). Accordingly,the interlayer insulating layer 130 may partially cover an edge of theupper surface of the first conductive layer 213 a. In an implementation,the first upper surface 213 a′ (that is a part of the upper surface ofthe first conductive layer 213 a) may be understood as a portion that isnot covered by the interlayer insulating layer 130 in the upper surfaceof the first conductive layer 213 a.

The second conductive layer 215 c (of the electrode power supply lineEPSL) may be located at least partially on the first upper surface 213a′ of the first conductive layer 213 a and the interlayer insulatinglayer 130, e.g., the first insulating layer. In an implementation, apart of the second conductive layer 215 c may be covered by a protectivelayer 141, e.g., a second insulating layer. For example, the protectivelayer 141 may partially cover the second conductive layer 215 c and mayinclude a second opening OP2 that exposes a second upper surface 215 c′(e.g., an outwardly facing surface, and including at least a centerportion of the upper surface of the second conductive layer 215 c (in a+z direction)). Accordingly, the protective layer 141 may cover at leasta part of an upper edge of the second conductive layer 215 c. In animplementation, the second upper surface 215 c′ (that is a part of theupper surface of the second conductive layer 215 c) may be understood asa part of the upper surface of the second conductive layer 215 c, whichis not covered by the protective layer 141. For example, an area of thesecond opening OP2 of the protective layer 141 may be less than that ofa first opening OP1 of the interlayer insulating layer 130.

The protective layer 141 may include the second opening OP2 in order toelectrically connect a third conductive layer 310 a (that may be furtherincluded in the electrode power supply line EPSL) to the secondconductive layer 215 c, as will be described below. Forming of thesecond opening OP2 in the protective layer 141 may be performed byvarious suitable methods, e.g., a dry etching method.

As described above, the second conductive layer 215 c may be located onat least a part of the first upper surface 213 a′ in the firstconductive layer 213 a and the interlayer insulating layer 130, e.g.,the first insulating layer, and the second conductive layer 215 c maycover an inner side surface 130 a of the first opening OP1. In animplementation, due to a step around the inner side surface 130 a of theinterlayer insulating layer 130, a thickness of the second conductivelayer 215 c around the inner side surface 130 a of the first opening OP1may be less than that of the second conductive layer 215 c of any otherpart.

When the second opening OP2 is formed by the drying etching method, alower layer of the protective layer 141 where the second opening OP2 isto be formed could be partially damaged. If the second opening OP2 wereto have a greater area than that of the first opening OP1 and formed bythe dry etching method, the second conductive layer 215 c around theinner side surface 130 a of the first opening OP1 in the interlayerinsulating layer 130 could be affected by the dry etching. The thicknessof the second conductive layer 215 c at the portion corresponding to theinner side surface 130 a may be less than that of other parts of thesecond conductive layer 215 c, and the second conductive layer 215 ccould be disconnected when the second opening OP2 is formed in theprotective layer 141.

However, according to the display apparatus of the embodiment, thesecond opening OP2 of the protective layer 141 may have an area that isless than that of the first opening OP1 in the interlayer insulatinglayer 130. Therefore, even if the second conductive layer 215 c (that isunder the protective layer 141 in which the second opening OP2 is to beformed) were to be partially damaged when the second opening OP2 isformed by the dry etching method, the portion of the second conductivelayer 215 c around the inner side surface 130 a of the first opening OP1of the interlayer insulating layer 130 may not be damaged or may be lessdamaged. This is because the protective layer 141 above or on theportion of the second conductive layer 215 c around the inner sidesurface 130 a may not be removed, as shown in FIG. 6. Therefore,according to the display apparatus of the embodiment, defects such as adisconnection in the second conductive layer 215 c may be reduced and/oreffectively prevented.

As described above, due to the step around the inner side surface 130 aof the interlayer insulating layer 130, the thickness of the secondconductive layer 215 c around the inner side surface 130 a of the firstopening OP1 in the interlayer insulating layer 130 may be less than thatof the other parts in the second conductive layer 215 c. As describedabove, a portion of the second conductive layer 215 c, which is small inthickness, may be a portion having a step disposed thereunder. In thiscase, the upper surface of the second conductive layer 215 ccorresponding to the step may also have a curved surface correspondingto a shape of the step. Therefore, in order to help reduce and/orprevent defects (such as the disconnection in the second conductivelayer 215 c), the curved surface in the upper surface of the secondconductive layer 215 c may not be exposed by the second opening OP2 ofthe protective layer 141. For example, the protective layer 141 mayentirely cover the curved surface in the upper surface of the secondconductive layer 215 c (in the +z direction).

As described above, the portion that is small in thickness in the secondconductive layer 215 c may have the step thereunder. In this case, theupper surface of the second conductive layer 215 c corresponding to thestep may also have a curved surface corresponding to the shape of thestep. For example, if the center portion of the upper surface in thesecond conductive layer 215 c has a flat surface, the thickness of thesecond conductive layer 215 c at the flat surface may be understood tobe constant.

The portion of the second conductive layer 215 c having the constantthickness may have a sufficient thickness that is set in advance, unlikethe portion of the second conductive layer 215 c around the inner sidesurface 130 a of the first opening OP1 in the interlayer insulatinglayer 130. Therefore, when the center portion of the upper surface inthe second conductive layer 215 c has the flat surface, the secondconductive layer 215 c may not be disconnected even if the flat surfacewere to be partially damaged due to the dry etching process performed onthe protective layer 141. Thus, when the protective layer 141, in whichthe second opening OP2 is formed, covers the second conductive layer 215c (except at least a part of the flat surface in the upper surface ofthe second conductive layer 215 c), disconnection of the secondconductive layer 215 c may be effectively prevented while sufficientlyexposing the second conductive layer 215 c.

In an implementation, as shown in FIGS. 5 and 6, the display apparatusaccording to the embodiment may further include the third conductivelayer 310 a. The third conductive layer 310 a may be an element of theelectrode power supply line EPSL, together with the second conductivelayer 215 c. The third conductive layer 310 a may be located on a secondupper surface 215 c′ that is not covered by the protective layer 141 inthe upper surface of the second conductive layer 215 c, and may be on orover the protective layer 141, e.g., a second insulating layer. Thethird conductive layer 310 a may be located on the second upper surface215 c′ that is not covered by the protective layer 141 in the uppersurface of the second conductive layer 215 c, and the third conductivelayer 310 a may be electrically connected to the second conductive layer215 c. The third conductive layer 310 a may help reduce the exposure ofthe upper surface of the second conductive layer 215 c to outside duringmanufacturing processes of the display apparatus, so as to help preventoxidation of the second conductive layer 215 c. The third conductivelayer 310 a may include a conductive oxide material, e.g., indium tinoxide (ITO) or indium zinc oxide (IZO).

In an implementation, as described above, the second opening OP2 of theprotective layer 141 may have the area that is smaller than that of thefirst opening OP1 of the interlayer insulating layer 130. Thus, the flatportion of the upper surface of the second conductive layer 215 c may beexposed through the second opening OP2 of the protective layer 141.Accordingly, an interface on which the second conductive layer 215 c andthe third conductive layer 310 contact each other may be a flat surfacethat is roughly in parallel with the upper surface of the substrate 100.Thus, contact between the second conductive layer 215 c and the thirdconductive layer 310 a may be ensured.

FIG. 8 illustrates a schematic cross-sectional view of the displayapparatus taken along a line VIII-VIII of FIG. 1, and shows an organiclight-emitting device 300 that is a display device in the display areaDA, a thin film transistor 210, and the electrode power supply lineEPSL. The organic light-emitting device 300 may be electricallyconnected to the thin film transistor 210, e.g., a pixel electrode 310of the organic light-emitting device 300 may be electrically connectedto one of a source electrode 215 a and a drain electrode 215 b of thethin film transistor 210. In an implementation, a thin film transistormay be also arranged in the peripheral area PA on the outer portion ofthe display area DA. The thin film transistor located in the peripheralarea PA may be a part of a circuit unit for controlling electric signalsapplied into the display area DA.

The thin film transistor 210 may include a semiconductor layer 211including amorphous silicon, polycrystalline silicon, or an organicsemiconductor material, a gate electrode 213, the source electrode 215a, and the drain electrode 215 b. A gate insulating layer 120 includingan inorganic material such as silicon oxide, silicon nitride, and/orsilicon oxynitride may be disposed between the semiconductor layer 211and the gate electrode 213, in order to help ensure an insulatingproperty between the semiconductor layer 211 and the gate electrode 213.

In addition, the interlayer insulating layer 130 including an inorganicmaterial such as silicon oxide, silicon nitride, and/or siliconoxynitride may be arranged on the gate electrode 213, and the sourceelectrode 215 a and the drain electrode 215 b may be arranged on theinterlayer insulating layer 130. As described above, an insulating layerincluding the inorganic material may be formed by a chemical vapordeposition (CVD) or an atomic layer deposition (ALD) method. In animplementation, the interlayer insulating layer 130 may be identicalwith the interlayer insulating layer 130, e.g., the first insulatinglayer, covering at least a part of the edge of the first conductivelayer 213 a. For example, the interlayer insulating layer 130, that is,the first insulating layer, may include the same material as that of theinterlayer insulating layer 130 that is disposed between the source anddrain electrodes 215 a and 215 b and the gate electrode 213.

As described above, the buffer layer 110 may be disposed between thethin film transistor 210 and the substrate 110 having the abovestructure. The buffer layer 110 may include an inorganic material suchas silicon oxide, silicon nitride, and/or silicon oxynitride. The bufferlayer 110 may help improve smoothness of the upper surface of thesubstrate 100, and/or may help prevent or reduce infiltration ofimpurities from the substrate 100 into the semiconductor layer 211 ofthe thin film transistor 210.

In an implementation, the protective layer 141 and a planarization layer142 may be arranged above the thin film transistor 210. The protectivelayer 141 may help protect the thin film transistor 210 againstimpurities during the manufacturing processes of the display apparatus,and may include an inorganic material such as silicon oxide, siliconnitride, or silicon oxynitride, or an organic insulating material.

The protective layer 141 may be identical with the protective layer 141,e.g., the second insulating layer, covering at least a part of the edgeof the second conductive layer 215 c. For example, the protective layer141, that is, the second insulating layer, may include the same materialas that of the protective layer 141 covering the thin film transistor210. For example, during the manufacturing processes of the displayapparatus, the protective layer 141, that is, the second insulatinglayer, may be formed simultaneously with the protective layer 141covering the thin film transistor 210 by using the same material.

The planarization layer 142 may help planarize an upper portion of theprotective layer 141 covering the thin film transistor 210. Theplanarization layer 142 may include an organic material, e.g., acryl,bezocyclobutene (BCB), and hexamethyldisiloxane (HMDSO). In animplementation, as illustrated in FIG. 8, the planarization layer 142has a single-layered structure. In an implementation, the planarizationlayer 142 may have a multi-layered structure. In addition, as shown inFIG. 8, the planarization layer 142 may have an opening at an outerportion of the display area DA so that a part of the planarization layer142 in the display area DA and a part of the planarization layer 142 onthe outer portion of the substrate 100 may be physically separate fromeach other. Then, impurities from outside may not reach the display areaDA via the planarization layer 142.

In the display area DA, the organic light-emitting device 300 includingthe pixel electrode 310, an opposite electrode 330, and an intermediatelayer 320 including an emission layer and disposed between the pixelelectrode 310 and the opposite electrode 330 may be located on theplanarization layer 142. The pixel electrode 310 may be electricallyconnected to the thin film transistor 210 by contacting one of thesource electrode 215 a and the drain electrode 215 b via an openingformed in the planarization layer 142 as shown in FIG. 8.

A pixel defining layer 150 may be on the planarization layer 142. Thepixel defining layer 150 may include openings corresponding respectivelyto sub-pixels, e.g., at least an opening exposing a center portion ofthe pixel electrode 310, to define pixels. Also, in the example shown inFIG. 8, the pixel defining layer 150 may increase a distance between anedge of the pixel electrode 310 and the opposite electrode 330 above thepixel electrode 310 so as to help prevent an arc from generating at theedge of the pixel electrode 310. The pixel defining layer 150 mayinclude an organic material, e.g., polyimide or hexamethyldisiloxane(HMDSO).

The intermediate layer 320 of the organic light-emitting device 300 mayinclude low-molecular weight organic materials or polymer organicmaterials. When the intermediate layer 320 includes a low-molecularweight organic material, the intermediate layer may include a holeinjection layer (HIL), a hole transport layer (HTL), an emission layer(EML), an electron transport layer (ETL), and an electron injectionlayer (EIL) in a single or multiple-layered structure. Examples oforganic materials may include copper phthalocyanine (CuPc),N,N′-Di(naphthalene-1-yl)-N,N′-diphenyl-benzidine (NPB), andtris-8-hydroxyquinoline aluminum (Alq₃). The low-molecular weightorganic materials may be deposited by a vacuum deposition method.

When the intermediate layer 320 includes a polymer material, theintermediate layer 320 may include a hole transport layer (HTL) and anemission layer (EML). In an implementation, the HTL may include PEDOT,and the EML may include a poly-phenylenevinylene (PPV)-based orpolyfluorene-based polymer material. The intermediate layer 320 abovemay be formed by a screen printing method, an inkjet printing method, ora laser induced thermal imaging (LITI) method.

In an implementation, the intermediate layer 320 may include a layerthat is integrally formed throughout a plurality of pixel electrodes310, or a layer that is patterned to correspond to each of the pluralityof pixel electrodes 310.

The opposite electrode 330 may be arranged above or on the display areaDA, and as shown in FIG. 8, may cover the display area DA. For example,the opposite electrode 330 may be integrally formed with respect to aplurality of organic light-emitting devices, so as to correspond to aplurality of pixel electrodes 310. The opposite electrode 330 may extendto at least a part of the peripheral area PA on the outer portion of thedisplay area DA so as to be electrically connected to the electrodepower supply line EPSL, as will be described below.

The organic light-emitting device could be easily damaged by theexternal moisture or oxygen. Thus, the encapsulation layer 400 may coverthe organic light-emitting device to protect the organic light-emittingdevice. The encapsulation layer 400 may cover the display area DA, andmay extend to outside the display area DA. In an implementation, theencapsulation layer 400 may include a first inorganic encapsulationlayer 410, an organic encapsulation layer 420, and a second inorganicencapsulation layer 430 as shown in FIG. 8.

The first inorganic encapsulation layer 410 may cover the oppositeelectrode 330, and may include silicon oxide, silicon nitride, and/orsilicon oxynitride. In an implementation, other layers such as a cappinglayer may be disposed between the first inorganic encapsulation layer410 and the opposite electrode 330. The first inorganic encapsulationlayer 410 may be formed along with a structure disposed thereunder, andmay have an upper surface that is not flat as shown in FIG. 8. Theorganic encapsulation layer 420 may cover the first inorganicencapsulation layer 410, and may have an even upper surface, unlike thefirst inorganic encapsulation layer 410. For example, the organicencapsulation layer 420 may have the even upper surface corresponding tothe display area DA. The organic encapsulation layer 420 may include oneor more of polyethylene terephthalate, polyethylene naphthalate,polycarbonate, polyimide, polyethylene sulfonate, polyoxymethylene,polyarylate, or hexamethyldisiloxane. The second inorganic encapsulationlayer 430 may cover the organic encapsulation layer 420, and may includesilicon oxide, silicon nitride, and/or silicon oxynitride. The secondinorganic encapsulation layer 430 may contact the first inorganicencapsulation layer 410 by an edge thereof at an outer portion of thedisplay area DA, in order not to expose the organic encapsulation layer420 to the outside.

As described above, the encapsulation layer 400 may include the firstinorganic encapsulation layer 410, the organic encapsulation layer 420,and the second inorganic encapsulation layer 430, and even if there is acrack in the encapsulation layer 400 in the above multi-layeredstructure, the crack may be disconnected between the first inorganicencapsulation layer 410 and the organic encapsulation layer 420 orbetween the organic encapsulation layer 420 and the second inorganicencapsulation layer 430. As such, forming of a path through whichexternal moisture or oxygen may infiltrate into the display area DA maybe prevented or reduced.

If desired, processes of forming a touch electrode of various patternsfor implementing a touch screen function or forming a touch protectivelayer for protecting the touch electrode on the encapsulation layer 400may be further performed. The touch electrode or the touch protectivelayer may be formed on the encapsulation layer 400 through processessuch as deposition. Otherwise, a touch panel prepared in advance toinclude the touch electrode may be attached to the encapsulation layer400 so that the display apparatus may have a touch screen function.

A polarization plate 520 may be attached on the encapsulation layer 400via an optically clear adhesive (OCA) 510. The polarization plate 520may reduce reflection of external light. For example, when the externallight that passed through the polarization plate 520 is reflected by anupper surface of the opposite electrode 330 and then passes through thepolarization plate 520 again, the external light passes through thepolarization plate 520 twice and a phase of the external light may bechanged. Therefore, a phase of reflected light may be different from thephase of the external light entering the polarization plate 520 and thusdestructive interference occurs, and accordingly, the reflection of theexternal light may be reduced and visibility may be improved. The OCA510 and the polarization plate 520 may cover an opening in theplanarization layer 142 as shown in FIG. 8.

In an implementation, the display apparatus according to the embodimentmay not include the polarization plate 520, and if desired, thepolarization plate 520 may be omitted or replaced with anothercomponent. For example, the polarization plate 520 may be omitted, andinstead, a black matrix and a color filter may be provided to reduce thereflection of external light in the display apparatus.

In the display apparatus according to the embodiment, the firstconductive layer 213 a located where the electrode power supply lineEPSL is disconnected may include a material that is the same as that ofthe gate electrode 213 of the thin film transistor 210. For example, thefirst conductive layer 213 a may include the same material as that ofthe gate electrode 213 of the thin film transistor 210 and may be formedsimultaneously with the gate electrode 213. The first conductive layer213 a may include, e.g., molybdenum.

In an implementation, the second conductive layer 215 c included in theelectrode power supply line EPSL may include the same material as thatof the source electrode 215 a and the drain electrode 215 b in the thinfilm transistor 210. For example, the second conductive layer 215 c maybe formed simultaneously with the source and drain electrodes 215 a and215 b in the thin film transistor 210, by using the same material asthose of the source and drain electrodes 215 a and 215 b. Likewise, thethird conductive layer 310 a included in the electrode power supply lineEPSL may include the same material as that of the pixel electrode 310 ofthe organic light-emitting device 300 in the display area DA. Forexample, the third conductive layer 310 a may be formed simultaneouslywith the pixel electrode 310 of the organic light-emitting device 300 inthe display area DA, by using the same material as that of the pixelelectrode 310. The second conductive layer 215 c may include a titaniumlayer, an aluminum layer, and/or an additional titanium layer asdescribed above, and the third conductive layer 310 a may include aconductive oxide material such as ITO and IZO as described above.

In an implementation, a touch electrode of various patterns forimplementing the touch screen function may be located on theencapsulation layer 400. When forming the touch electrode, the thirdconductive layer 310 a may be formed at the same time by using the samematerial as that of the touch electrode. The above configuration offorming the third conductive layer 310 a simultaneously with the formingof the touch electrode may be applied to display apparatuses describedabove or will be described later.

The electrode power supply line EPSL may be electrically connected tothe opposite electrode 330 so as to apply electric signals to theopposite electrode 330. The electric connection structure between theelectrode power supply line EPSL and the opposite electrode 330 is shownin FIG. 9 that is a schematic cross-sectional view of the displayapparatus taken along a line IX-IX of FIG. 1. As shown in FIG. 9, theopposite electrode 330 extends to the peripheral area PA on the outerportion of the display area DA, so as to contact the third conductivelayer 310 a that is included in the electrode power supply line EPSL. Assuch, electric signals may be applied to the opposite electrode 330. Ifthe electrode power supply line EPSL does not include the thirdconductive layer 310 a but only includes the second conductive layer 215c, the opposite electrode 330 may contact the second conductive layer215 c.

As shown in FIG. 9, a dam 150 a may be located at an edge of theperipheral area PA of the substrate 100. The dam 150 a may include thesame material as that of the pixel defining layer 150 in the displayarea DA. For example, the dam 150 a may be formed simultaneously withthe pixel defining layer 150 by using the same material as the pixeldefining layer 150. The dam 150 a may help prevent a material forforming the organic encapsulation layer 420 from overflowing to the edgeof the substrate 100 when the encapsulation layer 400 is formed. In thiscase, the first inorganic encapsulation layer 410 and the secondinorganic encapsulation layer 430 may contact each other at an outerportion of the organic encapsulation layer 420, and moreover, the firstinorganic encapsulation layer 410 and the second inorganic encapsulationlayer 430 may extend near the edge of the substrate 100 beyond the dam150 a.

In an implementation, when the thin film transistor 210 is formed asshown in FIG. 8, contact holes need to be formed in the gate insulatinglayer 120 and the interlayer insulating layer 130 in order for thesource and drain electrodes 215 a and 215 b to contact the semiconductorlayer 211. The first opening OP1 (see FIG. 6) in the interlayerinsulating layer 130, e.g., the first insulating layer, may be formed atthe same time when the contact holes in the thin film transistor areformed.

In an implementation, in order for the pixel electrode 310 to contactthe source electrode 215 a or the drain electrode 215 b of the thin filmtransistor 210 in the display area DA, via holes need to be formed inthe protective layer 141 and the planarization layer 142. The secondopening OP2 (see FIG. 6) of the protective layer 141, e.g., the secondinsulating layer, may be formed at the same time when the via holes areformed. For example, if associated parts of the planarization layer 142are removed when the second opening OP2 is formed in the protectivelayer 141, an inner surface of the second opening OP2 in the protectivelayer and an inner surface of the opening in the planarization layer 142may be identical with each other.

If an etch rate of the material for forming the planarization layer 142is greater than that of the material for forming the protective layer141, an inner surface 141 a of the second opening OP2 in the protectivelayer 141 and an inner surface 142 a of the opening in the planarizationlayer 142 may not be identical with each other as shown in FIG. 8. Forexample, the inner surface 142 a of the opening in the planarizationlayer 142 may be located on the upper surface of the protective layer141. The structure shown in FIG. 8 may be also obtained when the openingis formed in the planarization layer 142 in a separate process afterforming the second opening OP2 in the protective layer 141.

In an implementation, the display apparatus may include both theprotective layer 141 and the planarization layer 142. In animplementation, the display apparatus may only include the protectivelayer 141, without including the planarization layer 142. In animplementation, the display apparatus may only include the planarizationlayer 142, without including the protective layer 141. In latter case,the above descriptions about the protective layer 141 in theabove-described embodiments and modified examples thereof may be appliedto the planarization layer 142.

By way of summation and review, in some display apparatuses, defectivepixels could occur in the display area at a portion adjacent toterminals of the wires on the periphery during manufacturing of thedisplay apparatus, or defective pixels could occur at the portionadjacent to the terminals of the wires on the periphery while moving thedisplay apparatus.

According to the one or more embodiments, the display apparatus capableof reducing a possibility of generating defects during manufacturingprocesses or utilization processes thereof may be implemented.

The embodiments may provide a display apparatus capable of reducing apossibility of defects when the display apparatus is manufactured orused.

Example embodiments have been disclosed herein, and although specificterms are employed, they are used and are to be interpreted in a genericand descriptive sense only and not for purpose of limitation. In someinstances, as would be apparent to one of ordinary skill in the art asof the filing of the present application, features, characteristics,and/or elements described in connection with a particular embodiment maybe used singly or in combination with features, characteristics, and/orelements described in connection with other embodiments unless otherwisespecifically indicated. Accordingly, it will be understood by those ofskill in the art that various changes in form and details may be madewithout departing from the spirit and scope of the present invention asset forth in the following claims.

What is claimed is:
 1. A display apparatus, comprising: a substrate thatincludes a display area and a peripheral area, the peripheral area beingoutside of the display area; a first conductive layer in the peripheralarea; a first insulating layer that includes a first opening exposing afirst upper surface of the first conductive layer, the first insulatinglayer covering at least a part of an upper edge of the first conductivelayer, wherein the first upper surface of the first conductive layerincludes at least a portion of an upper surface of the first conductivelayer; a second conductive layer on at least a part of the first uppersurface of the first conductive layer and on the first insulating layer;and a second insulating layer that includes a second opening exposing asecond upper surface of the second conductive layer, the secondinsulating layer covering at least a part of an upper edge of the secondconductive layer, wherein the second upper surface of the secondconductive layer includes at least a portion of an upper surface of thesecond conductive layer and, when viewed in a direction perpendicular tothe substrate, an entire edge of the second opening is located inside anedge of the first opening.
 2. The display apparatus as claimed in claim1, wherein: the upper surface of the second conductive layer includes aflat portion at a center portion thereof, and the second insulatinglayer covers the upper surface of the second conductive layer except atleast a part of the flat portion.
 3. The display apparatus as claimed inclaim 1, wherein: the upper surface of the second conductive layer has acurved surface in a part thereof, and the second insulating layer coversthe curved surface of the upper surface of the second conductive layer.4. The display apparatus as claimed in claim 1, further comprising athin film transistor in the display area, the thin film transistorincluding a gate electrode, a source electrode, and a drain electrode,and wherein: the first conductive layer includes a material that is thesame as a material of the gate electrode, and the second conductivelayer includes a material that is the same as a material of the sourceelectrode and the drain electrode.
 5. The display apparatus as claimedin claim 4, wherein: the first insulating layer includes a material thatis the same as a material of an interlayer insulating layer that isbetween the source and drain electrodes and the gate electrode, and thesecond insulating layer includes a material that is the same as amaterial of a protective layer covering the source electrode and thedrain electrode.
 6. The display apparatus as claimed in claim 5,wherein: the first insulating layer is integral with the interlayerinsulating layer, and the second insulating layer is integral with theprotective layer.
 7. The display apparatus as claimed in claim 1,further comprising a third conductive layer on the second upper surfaceof the second conductive layer and the second insulating layer.
 8. Thedisplay apparatus as claimed in claim 1, further comprising: a thin filmtransistor in the display area, the thin film transistor including agate electrode, a source electrode, and a drain electrode; and a pixelelectrode electrically connected to one of the source electrode and thedrain electrode, wherein: the first conductive layer includes a materialthat is the same as a material of the gate electrode, the secondconductive layer includes a material that is the same as a material ofthe source electrode and the drain electrode, and the third conductivelayer includes a material that is the same as a material of the pixelelectrode.
 9. The display apparatus as claimed in claim 8, wherein: thefirst insulating layer includes a material that is the same as amaterial of an interlayer insulating layer between the source and drainelectrodes and the gate electrode, and the second insulating layerincludes a material that is the same as a material of a protective layercovering the source electrode and the drain electrode.
 10. The displayapparatus as claimed in claim 9, wherein: the first insulating layer isintegral with the interlayer insulating layer, and the second insulatinglayer is integral with the protective layer.
 11. The display apparatusas claimed in claim 1, further comprising an opposite electrode that isprovided integrally throughout the display area and extending to a partof the peripheral area, wherein the opposite electrode electricallycontacts the third conductive layer.
 12. The display apparatus asclaimed in claim 7, wherein the third conductive layer contacts thesecond conductive layer through the second opening.
 13. The displayapparatus as claimed in claim 12, further comprising a third insulatinglayer between the second insulating layer and the third conductivelayer.
 14. The display apparatus as claimed in claim 1, wherein thethird insulating layer includes an organic material.
 15. The displayapparatus as claimed in claim 1, further comprising an oppositeelectrode that is provided integrally throughout the display area andextending to a part of the peripheral area, wherein the oppositeelectrode is electrically connected to the second conductive layer. 16.The display apparatus as claimed in claim 1, wherein the firstconductive layer has an island shape.
 17. The display apparatus asclaimed in claim 1, wherein, when viewed in the direction perpendicularto the substrate, an area of the second opening is smaller than an areaof the first opening.
 18. A display apparatus, comprising: a substratethat includes a display area and a peripheral area, the display areaincluding pixels and the peripheral area being outside of the displayarea; and an electrode power supply line electrically connected to thepixels of the display area, wherein the electrode power supply lineincludes: a connecting conductive layer, and a main conductive layerconnected by the connecting conductive layer, wherein the connectingconductive layer has a connection side that is connected to the mainconductive layer and a substrate facing side that is opposite to theconnection side and that faces the substrate, wherein a first insulatinglayer overlies an outer edge of the connection side of the connectingconductive layer and includes a first opening that is open on a centralportion of the connection side of the connecting conductive layer,wherein the main conductive layer contacts the connection side of theconnecting conductive layer at the central portion of the connectionside of the connecting conductive layer, and wherein a second insulatinglayer overlies an outer edge of an outwardly facing surface of the mainconductive layer and includes a second opening that is open on a centralportion of the outwardly facing surface of the main conductive layer,and wherein, when viewed in a direction perpendicular to the substrate,an entire edge of the second opening is located inside an edge of thefirst opening.
 19. The display apparatus as claimed in claim 18, furthercomprising a third conductive layer on the outwardly facing surface ofthe main conductive layer and the second insulating layer.
 20. Thedisplay apparatus as claimed in claim 19, further comprising a thirdinsulating layer between the second insulating layer and the thirdconductive layer, the third insulating layer including an organicmaterial.